Unlocking Hot Melt Performance
Linking thermal analysis, rheology, and surface science
Hot melt adhesives must deliver consistent quality, stable processing, and reliable adhesion. In this partner webinar hosted by NETZSCH, the speakers present a practical, multi-method workflow combining thermal analysis, rheology, and surface science to fully characterize two representative hot melt systems.
Register for your preferred time slot
Tuesday, May 26, 2026
▶ Timeslot 1: 9 am CEST (7 am UTC)
▶ Timeslot 2: 10 am EDT (2 pm UTC)
What we'll be talking about
Starting with NETZSCH DSC and TGA, we demonstrate how to identify materials, support incoming goods inspection, and assess thermal stability. Rheological analysis with the Kinexus rheometer then provides insights into viscosity, viscoelasticity, and flow behavior—key to understanding processability. Finally, KRÜSS Drop Shape Analysis reveals the effects of thermal damage at the interface and the impact this can have on hotmelt adhesion properties.
What you will learn
- How DSC enables material identification and quality control
- How TGA evaluates thermal stability
- How rheology defines processing windows and flow behavior
- How thermal degradation changes interfacial properties and the impact on adhesion performance
Join us to discover how combining these techniques creates a complete workflow—from raw material verification to optimized application performance.
Presenters
- Dr. Stefan Schmölzer earned his degree with a focus on polymer and colloid chemistry. He has expert knowledge of polymer materials and works as Application Specialist for TSC, TGA, and DEA at NETZSCH Analyzing & Testing.
- Torsten Remmler graduated in physics, has extensive expertise in instrumental analysis and, as a rheology specialist, is responsible for Sales and Application support at NETZSCH Analyzing & Testing.
- Dr. Andrew Mellor obtained an engineering doctorate in surface and interfacial physics/chemistry and serves as Team Lead Application Market Manager to the KRÜSS customer network.